2026 IEEE 76th Electronic Components and Technology Conference (IEEE ECTC 2026)

AboutComponents,Circuits,DevicesandSystems;EngineeredMaterials,DielectricsandPlasmas;EngineeringProfession;PhotonicsandElectrooptics
Keywords:Thetechnicalprogramcontainspaperscoveringleadingedgedevelopmentsandtechnicalinnovationsacrossthepackagingspectrum.Topicsincludeadvancedpackaging,modelingandsimulation,Photonics,interconnections,materialsandprocessing,appliedreliability,assemblyandmanufacturingtechnology,componentsandRF,andemergingtechnologies.,,,
Scope:TheElectronicComponentsandTechnologyConference(ECTC)isthepremierinternationaleventthatbringstogetherthebestinpackaging,componentsandmicroelectronicsystemsscience,technologyandeducationinanenvironmentofcooperationandtechnicalexchange.ECTCissponsoredbytheIEEEElectronicsPackagingSociety.
SponsorType:1